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Re: major bonding bug?

To: Amir Noam <amir.noam@xxxxxxxxx>
Subject: Re: major bonding bug?
From: Jay Vosburgh <fubar@xxxxxxxxxx>
Date: Tue, 30 Dec 2003 16:03:28 -0800
Cc: "Jeff Garzik" <jgarzik@xxxxxxxxx>, "Hen, Shmulik" <shmulik.hen@xxxxxxxxx>, "Marom, Noam" <noam.marom@xxxxxxxxx>, netdev@xxxxxxxxxxx
In-reply-to: Message from Amir Noam <amir.noam@intel.com> of "Tue, 30 Dec 2003 18:45:14 +0200." <200312301845.14275.amir.noam@intel.com>
Sender: netdev-bounce@xxxxxxxxxxx
>> This looks very wrong...  bonding mode should be per-interface, not
>> global to the entire driver.  What happens when a user wants
>> BOND_MODE_ROUNDROBIN on bond0, and BOND_MODE_TLB on bond1?
>
>We agree that it looks very wrong, and this is in fact one of the 
>features we've been working on lately. It is not a trivial fix, 
>since, as you've noted, a lot of the code depends on the bond 
>settings being global. We plan to start releasing patches to address 
>this issue very soon (probably even starting tomorrow).

        FWIW, the workaround is to load the bonding module multiple
times (once for each desired mode).

        -J

---
        -Jay Vosburgh, IBM Linux Technology Center, fubar@xxxxxxxxxx

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