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Emerging Non Volatile Memory (NVM) Technology 2015 Emerging NVM technological choices are about to be made by key players: STTMRAM/MRAM or RRAM?
Over the last two years, the complex emerging non-volatile memory (NVM) situation has been greatly simplified.
In 2014, Micron, the main phase-change memory (PCM) promoter for stand-alone memory, stopped actively selling PCM chips following the collapse of sales targeting the shrinking entry-level mobile phone market. At the same time, Micron developed a resistive random access memory (RRAM or ReRAM) chip with Sony, part of a technology class that includes conductive bridge RAM (CBRAM). At 16 Gb the Micron-Sony RRAM has the highest density commercialized among emerging NVM technologies. Thus, we believe that PCM is now out of the race for stand-alone memory. For embedded microcontroller unit (MCU) applications 2015 will be a key year as STMicroelectronics, the main PCM promoter in this market, will choose if PCM will remain in its roadmap.
For more information please click on:
http://www.researchandmarkets.com/publication/m4ptyyq/emerging_non_volatile_memory
The new emerging NVM report is thus focused on the two most promising technologies:RRAM and magnetoresistive RAM (MRAM). The most attractive category of MRAM is spin-transfer torque magnetoresistive RAM (STTMRAM) that provides higher scalability/density. A main selection criterion for memory is the scalability/density of the chips, as this impacts both performance and cost. The Yole report provides a precise memory roadmap in terms of technological nodes, chip density and pricing.
STTMRAM/MRAM and RRAM have different features and positioning. Nevertheless, they will compete in 2015 and 2016 in some standalone markets, with storage class memory for enterprise storage being the biggest one. They will also compete in embedded MCU markets in the wearable, smart card and other markets. Micron has already selected RRAM for 2015 and other key stand-alone players like Samsung and SK Hynix should react quickly. In the embedded memory space, only Panasonic has selected RRAM and many key players have not yet made their choice. There is still high uncertainty over what will be the best technology to adopt. The next two years will therefore be critical for the future. There are multiple selection criteria, including scalability, retention, speed, endurance and cost. Making the right choice is not an easy task, but this report will provide insights about the main market drivers for each type of memory in each application.
In the long term, STTMRAM is sure to be the only candidate to substitute DRAM thanks to its high endurance. RRAM is sure to substitute NAND thanks to its high scalability/low cost.
This report provides a market forecast for each technology by application, in units, in Gbit, revenues and also number of wafers. It also presents a precise review of all the latest technical developments by the main players to understand the status of the technology and the main technical challenges.
Higher density emerging NVM chips will extend the accessible market from niches to DRAM and NAND mass markets:
The emerging NVM report describes why and how emerging NVM technologies will be increasingly used in various markets. The key markets are: industrial & transportation; enterprise storage; wearable; mobiles phones; mass storage; and MCU smart card and other markets.
For more information please click on:
http://www.researchandmarkets.com/publication/m4ptyyq/emerging_non_volatile_memory
Title Index:
Executive summaryStandard memory market introduction
NAND market overview
DRAM market overview
"Niche" stand alone memory: OverviewEmbedded SoC memory: OverviewMemory Market players overview
Emerging NVM: Overview
- Segmentation / density evolution
- Stand alone memory position in 2014: commercial products performances
- Recent emerging memory products introduction
- Market forecast by technology 2014
- 2020 (in $M / in M Gbit / in # of wafers 12" eq)
- Strategy example: Hynix / Micron / Samsung
- Roadmap: stand alone devices and embedded SoC devices
- Players position
- Dominant players: acquisitions & alliances
- Startup funding
- New emerging NVM players
- Dominant embedded memory MCU players and emerging NVM involvement
- Equipment players involved in Emerging NVM
- Supply chain
- Foundries growing influence thanks to emerging NVM
Emerging NVM applications
- Definitions and specifications
- Positioning: SCM definition
- Positioning by application and current memory used
- 2014 average sales price by application
- Memory density requirements by applications
- Time to market by application / application analysis
- Emerging memories potential applications : density and price positioning
- Market forecast and key industrial players by application
Industrial & transportation applications
Enterprise storage applications
- Description
- Infrastructure server applications are booming thanks to growing internet needs
- Cloud data centers market and enterprise SSD market are booming
- SSD market players
- Enterprise storage applications need SCM to reduce latency
- STT MRAM SCM solution
- Avalanche MRAM based enterprise storage systems
- RRAM SCM solution
- Enterprise storage supply chain
MCU smart card & other markets
- Description
- MCU market players
- Global smart card market
- Smart card telecom NFC market
- Government/ID card forecast
- Smart card MCU market and players
- Embedded flash NOR technology
- MCU supply chain - Smart card focus
- Main MCU smart card players: involvement in emerging NVM
Wearable applications
- Description / market forecast
- Wearable players : ST Microelectronics / Qualcomm / Adesto / ARM
- Wearable memory architecture and requirements
- Power consumption issue / supply chain
Mobile devices applications
- Description / forecast
- SoC cache memory application
- Players : Toshiba / Qualcomm
- Mobile devices SoC supply chain
Mass storage NAND market
- Description / Mobile devices and SSD drive growth
- Big challenge for emerging NVM: develop a 3D approach
- Players : Sandisk / Crossbar Inc
MRAM technology, forecast & players
- MRAM and STT MRAM technologies description / time to market by application / players positioning / start up's funding / roadmap (stand alone devices) / embedded roadmap / Market forecast in units, Gbit, $/Gbit, $, Wafers
- Singapore MRAM cluster
- MRAM market players: Everspin (US) / Honeywell Aerospace (US) / Aeroflex (US) / Samsung/ Micron/ SK Hynix / Toshiba/ Avalanche technology (US) / Spin Transfer Technologies (US) / Crocus technology (FR) / IMEC/ TDK headway technologies
- Embedded MRAM/STTMRAM players: Qualcomm/TSMC/Infineon / ST Microelectronic / Spintec/ Renesas
RRAM technology & forecast & players 245
- Description / time to market and players by application: players positioning / Chip maximum density roadmap (stand alone devices) / embedded roadmap / market forecast in units, Gbit, $/Gbit, $, wafers / material candidates
- 3D RRAM challenge : sneak current effect
- RRAM main players: Crossbar Inc / Micron
- Sony / Adesto / Rambus & Unity / Samsung/ HP/ SK Hynix / IMEC/ Sandisk/ TSMC
- Embedded RRAM players: Altis Semiconductor / Panasonic/ ST microelectronics / TSMC / Infineon / Freescale Rambus / Symetrix / Evaderis
PCM Technology, forecast & players 308- PCM technology description / players positioning / development history
- Micron profile / Future product
- Samsung's PCM product
- SK Hynix's PCM development
- Embedded PCM players: ST Microelectronics'/IBM
General conclusions
Companies Mentioned:
- A *STAR
- Adesto
- Aeroflex
- Altis
- Apple
- Atmel
- Avalanche
- Buffalo
- CNE
- Cisco
- Crocus
- Crossbar
- Cypress
- Dell
- EMC
- Ebay
- Evaderis
- Everspin
- Facebook
- Freescale
- Fujitsu
- Fusion IO
- Gemalto
- Giesecke&Devrient
- Global Foundries
- Google
- HP
- HP
- Honeywell
- IBM
- IBM
- IBM
- Imec
- Infineon
- Innovative silicon
- Intel
- Lapis
- Macronix
- Maxim
- Microchip
- Micron-Elpida
- Morpho
- NEC
- NXP
- Nanya
- NetApp
- Nike
- Nokia
- Numonyx
- Oberthur
- Panasonic
- Qualcomm
- Quantum
- Rambus- Unity
- Renesas
- SGI
- SK Hynix
- SMIC
- ST Microelectronics
- STEC
- Samsung
- Sandisk
- Skyera
- Smart modular technologies
- Sony
- Spansion
- Spin Transfer technology
- Sun
- Symetrix
- TDK
- TMS
- TSMC
- Toshiba
- Towerjazz
- UMC
- Violin Memory
- Winbond
Pricing:
Electronic (Single User): EUR 3990
Electronic (Enterprisewide): EUR 5990
Ordering - Three easy ways to place your order:
1] Order online: Please
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Thank you for your consideration.
Best Regards,
Amy Cole
Senior Manager
Research and Markets Ltd
amy.cole@xxxxxxxxxxxxxxxxxxxxxx
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